Engineer, Senior(Technology Integration - Wafer-level Packaging)

Company

RF360 Singapore Pte., Ltd.

Job Area

Engineering Group, Engineering Group > Process Development Engineering

General Summary

As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Process Development Engineer, you will develop new or modified products, materials, and process formulations that meet and exceed customer expectations and enable cutting-edge, world class products. Qualcomm Engineers collaborate across functions and with externals customers to enhance the application of new product technology and manufacturing.

Minimum Qualifications

• Bachelor's degree in Engineering, Science, or related field and 2+ years of Product/Process Development or related work experience.
  
  

OR

Master's degree in Engineering, Science, or related field and 1+ year of Product/Process Development or related work experience.

OR

PhD in Engineering, Science, or related field.

Job Scope

• Responsible for end‑to‑end development, qualification, and mass‑production transfer of new processes, materials, and manufacturing technologies.
• Ensure process readiness, robust manufacturability, and smooth ramp‑up through strong cross‑functional coordination, data‑driven decision‑making, and technology leadership.
• Initiate and participate actively in discussions on formulation of process technology innovation and release process improvement.
• Collaborate and develop effective working relationships with technology partners to accomplish project/ task goals within committed schedule.
• Develop new and impactful ideas, materials, solutions, and/ or procedures for product fabrication process and technology meeting the business goals and launch schedule with competitive manufacturing costs.
• Serve as technology subject matter expert applying technical knowledge and skills in own area of expertise to address moderately complex issues in manufacturing environment.
  
  

Job Responsibilities


Technology Development

• Lead development of new processes, modules, or integration flows from concept to qualification and manufacturing release.
• Define process requirements, success criteria, design‑of‑experiments (DOE), and characterization plans.
• Drive root‑cause analyses, failure mechanism studies, and improvement loops to achieve performance, yield, and reliability targets.
• Translate product requirements into process specifications and control strategies. Technology Transfer & Ramp
• Co-own the technology transfer roadmap with project leader - from pilot line to high‑volume manufacturing. Adapts to shifting priorities and resources while ensuring deadlines are met.
• Supervise and provide technical guidance to onsite process transfer activities, including documentation (PFMEA, etc), training, process replication, and equipment matching.
• Work with each process cluster to establish critical process windows, statistical control limits, and ramp‑readiness criteria.
• Coordinate and report ramp performance tracking (yield, scrap, cycle time, tool capability) and drive closure of gaps.
  
  

Education/ Experience Requirements


Bachelor's or Master's degree in Engineering (Materials, Chemical, Semiconductor, etc.).

• 3+ years of experience in process integration engineering, technology development, or a high volume manufacturing fab.
• Broad exposure to wafer-level packaging technology and processes.
• Demonstrated success leading cross disciplinary technology integration projects.
• Strong skills in DOE, SPC, data analytics, FMEA, and troubleshooting.
• Excellent communication, technical documentation, and stakeholder management skills.
  
  

Skills, Abilities & Knowledge


Resourceful with critical thinking in problem solving.

• Project and priority management skills.
• Experience in semiconductor, MEMS, packaging, or high‑volume manufacturing.
• Familiarity with yield engineering, reliability mechanisms, and failure analysis as well as use of statistical tools, DOE, PFCP/ PFMEA, etc.
• Experience with scale-up from R&D → Pilot → HVM.
• Knowledge of Lean, Six Sigma, or structured problem-solving (8D, DMAIC).
• Able to multi-task, set priorities and meet critical deadlines. Maintain open communication.
• Able attend training program overseas at sister's fab for up to 1 year.
  
  

Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail [Confidential Information] or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries).

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