Senior Staff Silicon Photonics Packaging Engineer

About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

Marvell is the leader in data movement interconnects between and inside data centers. We move big data fast, around the globe, with high quality and reliability. We offer semiconductor components and optical subsystems to our networking original equipment manufacturer (OEM), optical module, cloud and telecom service provider customers.

What You Can Expect

• Develop photonics IC (PIC) and electronics IC (EIC) co-design flow.

• Define PIC and EIC IO pad frame and 2.5D interposer floor plan.

• Lead PIC and EIC interconnect schematic and layout design process.

• Define PIC and EIC hybrid integration packaging design rules, process flow, and material sets.

• Lead optical package development to establish package manufacturability and reliability.

• Collaborate with cross-functional teams consisting of Digital and Analog Circuit designers, Signal/Power Integrity, and substrate layout, and system design team.

• Drive optical product package qualification activities from initial concept to production.

What We're Looking For

• Bachelor's degree in Computer Science, Electrical Engineering or related fields and 5+ years of related professional experience. Master's degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3+ years of experience,

• Expertise in designing hybrid multi-chip integration using 2.5D/3D packaging. Direct experience in Si Photonics based packaging design is a plus. Experience in layout desig tools for ICs and or packaging, and 2.5D/3D EM simulation tools such as HFSS, SI-Wave, Momentum, IE3D, CST, PowerSI.

• Device or package characterization andtesting as required in the development environment.High speed testing background is preferred.

• A strong understanding of wafer level packaging process flow.

• Direct experience in collaborating with major OSAT for developing advanced packaging technology for high-speed optics and/or electronics IC is a plus.

• Ability to work with a large body of data and the necessary statistical analysis tools, and the ability to present the data and ideas to a diverse audience.

• Effective communication and presentation

• Team player. Expected to work with cross-functional team.

Additional Compensation and Benefit Elements

With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We're dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it's like to work at Marvell, visit our page.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.

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