Senior Manager, MTE FE TIQ & Materials Cost

Micron Technology is a global leader in memory and storage solutions.
As the Senior Manager, MTE TIQ and Materials Cost, you will lead global Tool Installation Qualification (TIQ) strategy and Materials Cash Cost Value Engineering to achieve Best in Class (BIC) performance across Micron's front-end manufacturing network.

This role is accountable for driving standardised TIQ BKMs, enabling cross-site execution excellence, and delivering year-on-year cost-per-gigabit reductions through materials value engineering. You will partner closely with Fab Operations, Site Facilities & Global Facilities, Global Procurement, Central Engineering, Technology Development, and Suppliers.

Key Responsibilities

TIQ Strategy & Execution

• Define and drive global TIQ engineering strategy, BKMs, and business processes

• Lead year on year optimization in TIQ safety, schedule, cost, BKM and quality

• Monitor TIQ performance metrics, benchmark fab performance, and enable cross-site learning

• Provide tactical TIQ support to ramping and operating fabs

Front End Materials Cost & Value Engineering

• Drive Front End Materials Cash Cost VE (value engineering) strategy to achieve front-end manufacturing cost targets

• Lead cross-functional programs across Chemicals, Film & Gas, Photo, CMP materials, Bulk gas and UPW

• Partner with Procurement, suppliers and sites to identify, prioritize, and execute cost-reduction opportunities

• Ensure alignment of short and long-term materials cost roadmaps with corporate objectives

Program & Stakeholder Leadership

• Manage global portfolios of TIQ and cost programs to maximize ROI

• Define scope, milestones, resources, and risks drive issue resolution

• Influence global stakeholders to align on strategy, priorities, and execution plans

• Provide regular executive updates on progress, risks, and results

People & Capability Development

• Lead, mentor, and develop global engineering and program teams

• Set clear goals, development plans, and performance expectations

• Foster a culture of collaboration, accountability, continuous improvement, and safety

Core Competencies

• Strategic leadership with execution focus

• Global stakeholder influence

• Data-driven problem solving

• Strong prioritization and organizational skills

Qualifications

• Bachelor's Degree in Engineering (Master's preferred)

• Eligibility minimum E5 or M1+

• 5+ yrs semiconductor technical leadership or management experience in a 300mm FAB

• Strong knowledge of TIQ, front-end manufacturing, and front-end materials cost drivers

• Proven experience leading global, cross-functional teams and complex programs

• Strong analytical, communication, and fact-based decision-making skills

• Program / project management experience strongly preferred

• Willingness to travel internationally as required

  Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.