Signal Integrity Engineer (Package Substrate)
KEY RESPONSIBILITIES:
- Responsible for Signal Integrity in package substrate, cables, sockets/connectors, and PCBs
- Conduct analog and impedance characterization, including S-parameter processing.
- Perform measurements using tools/ equipment such as VNA, TDR, and high-speed oscilloscopes.
- Design test boards and measurement fixtures, and apply de-embedding methodologies.
- Collaborate effectively with cross-functional teams across multiple sites.
Job Requirements
- Master/Bachelor degree in Electrical Engineering, Microwave Engineering, or a related field
- Exposure to Signal Integrity (SI) characterization using VNA and TDR (time domain reflectometer)
- Background in S-parameter processing and impedance analysis.
- Familiarity with high-speed digital interfaces such as PCIe and DDR.
- Exposure to electrical modeling EDA tools (e.g., HFSS, SI wave, ADS).
- Solid understanding of electromagnetic theory and digital circuit analysis.
- Team player with a self-driven approach to problem-solving.
We invite suitable candidates to apply online or email your CV to [Confidential Information]
Ethos Search Associates Pte. Ltd.
EA License No: 13C6655
EA Reg No: R1109557 Rose
