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Responsibilities and Tasks:
Drive end‑to‑end front‑end process integration across multiple modules to support yield, functionality, and scalability
Lead cross‑module root cause analysis for complex yield detractors and integration issues
Support yield ramp, derivative matching, and node transitions through focused integration execution
Act as a core cPIE contributor for assigned programs, partnering closely with site PI/PE/Device teams
Develop and apply Best Known Methods (BKM) within owned integration scope
Provide technical input to POR/TOR and ECN decisions affecting integration margin
Apply data‑driven analysis to quantify process sensitivity, margin, and risk
Participate in SWAT teams and technical deep dives for high‑impact issues
Mentor junior engineers and contribute to knowledge sharing within CPIE
Collaborate with PI, PE, Device, Yield, TD, and Quality to accelerate learning cycles
Required Qualifications:
Bachelor's or Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related discipline
At least 3 years of strong front‑end semiconductor manufacturing experience, with demonstrated exposure to process integration across multiple modules
Proven ability to perform complex root‑cause analysis on yield, functionality, or integration issues using data‑driven methods
Solid understanding of device-process interactions and system‑level integration trade‑offs
Experience collaborating across PI, PE, Device, Yield, TD, and Quality organisations
Ability to influence technical decisions through analysis, insight, and technical credibility
Strong written and verbal communication skills for technical reviews, deep dives, and cross‑team alignment
Good to Have:
Direct experience supporting advanced DRAM technology nodes and/or technology ramps
Demonstrated ownership of integration loops, yield ramp activities, or derivative matching efforts
Experience contributing to or developing Best Known Methods (BKM), standard practices, or reusable integration solutions
Familiarity with POR/TOR definition, ECN review, and change risk assessment from an integration perspective
Exposure to statistical analysis, yield modelling, or advanced analytics applied to manufacturing data
Track record of leading or contributing to SWAT teams or high‑impact technical investigations
Experience mentoring junior engineers or serving as a technical reference within a team
Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to understand and control process deviations. Long-term investigation of defect issues may require extensive work with shift engineering and other functional areas. Evaluates products to ensure they meet the required design and performance specifications. Conducts research to assess process adjustment requirements and recommends process improvements or equipment changes needed to efficiently manufacture new product or part types.
Job ID: 145529599