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Position Overview
To support in the performance of Engineering functions such as wafer processing and performing quality inspections and other activities that may be required.
Responsibilities
Requirements
Job ID: 153827101
Skills:
cmp , Etching, process integration, lithography, deposition, Metrology, wafer fabrication, optical microscopy, yield improvement, defect analysis, Sem, root-cause analysis
Skills:
die-assembly tools, flip-chip bonders, semiconductor wafer packaging, photonics packaging processes, CAD drawing tools, wire bonders
Skills:
Ms Office, system design involving multiple axes servo pneumatic actuators, stepper and other drive sensing methods, low volume manufacturing methods
Skills:
finite element simulation, Jmp, plasma cleaning, Flip Chip process, Fmea, reflow, Minitab, structured 8D problem-solving, TCB NCP flux-less flow, pick place, SPC controls, flux engineering, underfill curing
Skills:
SPC tools, Data Analysis, Wafer processing, MES process control and reporting systems