cmp , Etching, process integration, lithography, deposition, Metrology, wafer fabrication, optical microscopy, yield improvement, defect analysis, Sem, root-cause analysis

die-assembly tools, flip-chip bonders, semiconductor wafer packaging, photonics packaging processes, CAD drawing tools, wire bonders

Ms Office, system design involving multiple axes servo pneumatic actuators, stepper and other drive sensing methods, low volume manufacturing methods

finite element simulation, Jmp, plasma cleaning, Flip Chip process, Fmea, reflow, Minitab, structured 8D problem-solving, TCB NCP flux-less flow, pick place, SPC controls, flux engineering, underfill curing

SPC tools, Data Analysis, Wafer processing, MES process control and reporting systems

uptime , promis , klarity , Rms, Spc, Si-View, 8D, SPC charts, Space, Doe, CAS procedures, SPSR, metrology tools, Ts16949, process matching, Ace, CIP programs, Cp, Jmp, ECN, Oee, TECN, SLDB, DCOP, CPK, mrb