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Join Micron as a Senior Process Development Engineer, Dry Etch, NAND, and join a passionate team advancing next-generation NAND process technologies. You will collaborate with proficient professionals, develop inventive process, and assist us in achieving seamless delivery on our demanding projects.
Responsibilities:
Rapid deployment of new NAND process technologies.
Drive development efforts prior to device ramp
Define and complete effective actions to enable solutions required to hit key achievements and achieve the required performance within timelines
Complex process development tasks related to ongoing evaluation of Dry Etch tool performance, examination of Dry Etch process windows, and adjustments or refinement of Dry Etch recipes within 3D NAND technology
Troubleshoot processes as part of cross-functional teams, driving yield and quality improvement.
Take initiative to identify and own areas for improvement, collaborating with other Fabs and TD teams.
Proactively identify exciting processes and work with Fabs to find viable solutions
Drive process simplification initiative across cross-functional teams.
Integrate best-known manufacturing methods into the early development phase of upcoming nodes
Successful candidates for this position will have:
PhD degree in Material Science, Physics, Chemistry, Electrical/Electronics Engineering, or Bachelors/Masters in Material Science, Physics, Chemistry, Electrical/Electronics Engineering with minimum of 3 years of semiconductor dry etch process development background
Proven track record of strong publication, patent, or invention disclosure.
Strong interest in technology development and crafting production-worthy technologies
Ability to build and maintain relationships with cross-functional teams and vendors
Excellent communication skills (written, verbal, and presentation).
Proficiency in statistics, data analysis, Design of Experiments (DOE), and comfort with analysis software tools.
Ability to work in a fast-paced and dynamic environment
Job ID: 143910383