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Position Overview
Design and develop advanced optoelectronic devices-including FP lasers, DFB lasers, EMLs and external cavity laser modules-to meet performance and product requirements. This role involves building test setups and characterization capabilities aligned with the company's technology roadmap and integrating these capabilities into in-house manufacturing processes.
Responsibilities
Requirements
Job ID: 148293999
Skills:
3d packaging , process qualification , thermal management , vision systems, failure analysis workflows, yield analysis, semiconductor process characterization, 2.5D Packaging, Flip Chip, Spc, CoPoS, CoWoS, Advanced Packaging, statistical analysis tools, HBM, Chiplet Integration, Doe, alignment systems, warpage control
Skills:
Elk, Prometheus, Bash, Networking, Grafana, Datadog, Linux Administration, Jenkins, Gcp, Docker, Terraform, Ansible, Distributed Systems, Helm, Azure, Kubernetes, Python, AWS, Go, EFK, GitHub Actions, ArgoCD
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