3d packaging , process qualification , thermal management , vision systems, failure analysis workflows, yield analysis, semiconductor process characterization, 2.5D Packaging, Flip Chip, Spc, CoPoS, CoWoS, Advanced Packaging, statistical analysis tools, HBM, Chiplet Integration, Doe, alignment systems, warpage control

Elk, Prometheus, Bash, Networking, Grafana, Datadog, Linux Administration, Jenkins, Gcp, Docker, Terraform, Ansible, Distributed Systems, Helm, Azure, Kubernetes, Python, AWS, Go, EFK, GitHub Actions, ArgoCD