Senior TCB Application & Technical Sales Engineer

Responsibilities:

• Engage semiconductor customers to understand packaging roadmap, process requirements, throughput targets, yield and reliability challenges.
• Support technical sales activities and customer discussions.
• Benchmark competitor equipment and identify technology gaps.
• Translate customer requirements into internal equipment specifications.
• Develop and optimize TCB process parameters on TCB Equipments.
• Support advanced packaging applications including HBM, CoWoS, CoPoS, 2.5D Packaging, 3D Packaging and Chiplet Integration.
• Troubleshoot bonding issues such as non-wet, misalignment, voids, delamination and warpage.
• Conduct DOE and process characterization activities.
• Work closely with Mechanical, Software, Electrical, Motion and Vision teams.
• Define alignment accuracy, thermal performance, bond force profiles, throughput targets and process windows.
• Lead machine qualification, FAT and SAT activities.
• Act as the internal customer during machine development.
• Support customer buyoff and onsite qualification activities.

Requirements:

• Bachelor's or Master's Degree in Materials Science, Mechanical Engineering, Electrical Engineering, Semiconductor Engineering or related fields.
• 5-15 years of semiconductor packaging experience preferred.
• Hands-on experience in TCB, Flip Chip and Advanced Packaging.
• Experience in HBM / CoWoS / 2.5D / 3D packaging.
• Experience in OSAT, IDM or semiconductor equipment environments preferred.
• Experience with fluxless or N2 bonding environment is an advantage.
• Strong understanding of Thermo Compression Bonding (TCB), Flip Chip processes, thermal management, warpage control, alignment systems, vision systems, process qualification, SPC and yield analysis.
• Experience with DOE, statistical analysis tools, failure analysis workflows and semiconductor process characterization.