Research Fellow

Interested applicants are invited to apply directly at the NUS Career Portal. Please note your application will only be processed if you apply via NUS Career Portal.

NUS Career Portal link - https://careers.nus.edu.sg/job/Research-Fellow-Electrical-Modelling-of-Advanced-Packaging/34872-en_GB/

We regret that only shortlisted candidates will be notified.

Job Description

The ECE Department at NUS is seeking a Research Fellow. An experienced and highly motivated Postdoctoral Researcher to develop analytical and equivalent-circuit models for next-generation advanced packaging and high-density interconnects. Research areas include 2.5D/3D integration, hybrid bonding, nano-through-silicon vias, backside power delivery networks, and electrical interfaces in co-packaged optics.
The successful candidate will investigate how interconnect geometry, material properties, fabrication processes, and packaging architecture affect electrical performance. Emphasis will be placed on power integrity (PI), signal integrity (SI), latency, bandwidth, energy per bit, and Device Junction Temperatures.
The role combines physical understanding, analytical modelling, circuit simulation, and experimental validation. It also involves developing reusable electrical models and contributing to process design kits (PDKs) that support the design and evaluation of advanced integration technologies.

Responsibilities will involve:

1. Analytical and Equivalent-Circuit Modelling
. Develop physics-based analytical models and lumped or distributed equivalent circuits for advanced interconnects and power delivery structures. Establish relationships between geometry, material properties, operating conditions, and electrical parameters, including resistance, inductance, capacitance, and conductance.

2. Electrical Performance Evaluation:
. Quantify and benchmark latency, usable bandwidth, and energy per bit. Evaluate trade-offs across interconnect dimensions, integration architectures, and operating conditions, accounting for driver, channel, and receiver contributions where relevant.

3. Signal Integrity Analysis:
. Investigate insertion loss, return loss, impedance discontinuities, reflections, crosstalk, and eye-diagram degradation. Translate these findings into design guidance for high-density, high-speed electrical links.

4. Power Integrity Analysis:
. Analyse DC IR drop, transient voltage droop, power delivery impedance, and resonances. Evaluate the effects of power and ground interconnects, decoupling capacitance, and supply distribution architecture on voltage stability.

5. PDK and Model Library Development:
. Develop parameterised compact models, reusable interconnect libraries, and associated documentation for packaging and interconnect PDKs. Define model validity ranges and capture process, geometry, and temperature variations to support predictive design.

6. Model Extraction and Validation:
. Extract model parameters from electromagnetic simulations, test structures, and electrical measurements. Validate analytical and equivalent-circuit models, quantify their accuracy, and identify the conditions under which simplified models remain reliable.

7. Research and Collaboration:
. Work closely with fabrication, packaging, device, and circuit researchers to connect process capabilities with electrical requirements. Publish research findings and contribute to project reports and technical milestones.

Qualifications

Education:
. Reporting to PI Prof Yu Chen-Hua.
. Ph.D. in Electrical and Electronics Engineering, Computer Engineering, Applied Physics, or a closely related discipline.
Experience:
. Experience developing compact models, parameterised model libraries, or electrical components of PDKs.
. Familiarity with electromagnetic parameter extraction and frequency-dependent interconnect modelling.
. Experience with electrical test structures, S-parameter measurements, time-domain reflectometry, or measurement de-embedding.
. Knowledge of 3D ICs, hybrid bonding, TSVs, redistribution layers, backside power delivery, or co-packaged optics.
. Experience with electro-thermal modelling and the effects of temperature and process variation on electrical performance.
. Proficiency in Python or MATLAB for parameter extraction, model fitting, sensitivity analysis, and automated design exploration.
. Supported by relevant research publications.
Technical Skills:
. Strong Fundamentals:
Sound understanding of circuit theory, electromagnetics, transmission lines, and the physical mechanisms governing interconnect and power delivery performance.
. Modelling Expertise:
Demonstrated ability to derive analytical models, construct equivalent circuits, and interpret simulation or measurement results using physical reasoning.
. Electrical Analysis:
Experience in one or more of signal integrity, power integrity, high-speed interconnects, or power delivery networks, with an understanding of performance trade-offs involving latency, bandwidth, and energy consumption.
. Computational Skills:
Experience with circuit simulation and numerical analysis using suitable tools, such as SPICE-compatible simulators, Python, or MATLAB. Expertise in a particular commercial EDA platform is not essential.
Others:
. Proficiency in data analysis and interpretation using statistical tools and software packages.
. Excellent communication skills and the ability to work effectively in a collaborative research environment.
. Motivated and possesses effective communication skills including writing and presenting.
. Ability to present complex technical concepts to multidisciplinary audiences.
. Open to Fixed Term Contract.