Jobscope:
- Introduce customer's new product to FAB and support in new product's tape out procedures to ensure pilot success.
- Improve new Product yield and ensure mass production inline, WAT and CP yield stable
- Define standard operation procedure for daily job
- Co-work with module engineers to solve production related issues. (inline, WAT, yield and reliability...)
- Co-work with module engineers to develop customized process to meet customer special requirement
Requirements:
- Possess at least a Bachelor's degree in Electronic Engineering, Electrical Electronic Engineering, Physics, Material Science
- Study in specialized in wafer chip or related semiconductor course
- Possess good communication skills
- Possess good time management skills as well as a strong sense of commitment
- Semiconductor device process engineer background is preferred
- Semiconductor foundry experiences is preferred
To apply, please visit www.gmprecruit.com
To learn more about this opportunity, please contact Fiona Koh | [Confidential Information]
We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Fiona Koh| Registration No: R11092398
