The Advanced Packaging Programme at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team at the forefront of semiconductor innovation. In this role, you will drive state-of-the-art chip-to-wafer and wafer-to-wafer fusion/hybrid bonding technologies, develop 2.5D interposer and 3D chip-stacking process integration flows, and enable heterogeneous integration of chiplets for next-generation Artificial Intelligence and High-Performance Computing applications. You will also lead electrical, thermal, and mechanical reliability characterization, contributing directly to technologies with real-world impact. This position offers an exciting opportunity to collaborate with a dynamic team of researchers and external industry partners while shaping the future of advanced packaging.
Conceptualise and lead internal capability development and external industry projects involving new materials, advanced process integration approaches, and innovative concepts.
Lead multi-disciplinary project team for the execution of industry projects with manageable risks and mentor less experienced colleagues.
Engage and manage internal and external stakeholders for the R&D projects execution and provide timely updates for timely deliverable.
Conduct research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements.
Investigate and refine wafer bonding processes for interposer fabrication, inter-dielectric gap fill, and alignment accuracy, addressing critical factors such as warpage, bonding strength, and yield.
Optimize die-bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, bonding materials and bonding methods.
Conduct engineering experiments for process characterization to drive quality and yield improvements.
Act as a subject matter expert (SME) for both internal and external stakeholders, providing guidance and expertise.
Collaborate with senior staff, process integrators, and external partners to address technology roadmap and process capabilities development.
Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.
PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
5 to 10 years of experience in device fabrication, back-end-of-line (BEOL) and advanced packaging processes & integration required for 2.5D/3D heterogeneous integration applications. Project and stakeholder (including industry partners) management experience will be added advantage. Hands-on experience in BEOL wiring processes & integration, C2W/W2W fusion/hybrid bonding and flip-chip bonding are required.
Strong knowledge in advanced packaging technologies in particular hybrid bonding equipment, bonding materials, processes & integration, and reliability characterization are preferable.
Strong analytical and problem-solving skills, with proficiency in data analysis, interpretation, and design of experiments. Demonstrated ability to troubleshoot and resolve process-related challenges. Excellent written and verbal communication skills.
Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
