As part of APTD SG Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron.
To lead new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You will need to have understanding of Frontend Process, packaging requirements, chip package interaction, equipment understanding and process technology in the industry. The ability to enable best technology for New Technode with packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve process related problems.
Ensure smooth transition from new process development, 1st qualification success to small volume production launch
Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule
Perform CPI NUDD, process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.
Qualify new process/technology/equipment/materials
Technical capability
Identify path finding opportunities for Micron's technology leadership with BIC time to market, continuous yield improvement, cost efficiency & touchpoint optimizations
To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process
Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance process performance.
Provide new solutions on time to meet company and customer needs
Define, develop and establish process capabilities, strategy and roadmap
To develop & engage creative solutions for new capabilities or to overcome the identified process constraints, ahead product requirements.
Job Requirements
PhD/Masters/Bachelor's Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
6 years and/or above experience in semiconductor industry
Experience in Frontend fab Process integration or Module process
Experience in Backend advance packaging wafer/ die level process or integration
Understanding of silicon integration and how it interacts at backend process & package level through CPI
Proficiency with simulation tools and data analytics platforms for performance analysis and optimization
Experience in temporary/ permanent bonding technology (Wafer on wafer, Chip on wafer) is a plus
Strong project management skills to ensure execution to timelines
Strong communication and presentation skills
Understanding of business needs and customers requirement
Ability to integrate & cooperate with people from cross function teams
