The successful candidate will be part of a multi-site Kulicke & Soffa (K&S) team responsible for the development, deployment, and sustainment of semiconductor assembly equipment.
The Process Engineer will provide technical and application support for K&S Clip Attach assembly equipment at customer sites, including Die Attach Bonders, Clip Attach Bonders, and Vacuum Reflow Ovens.
This role requires close collaboration with internal cross-functional teams (engineering, manufacturing, sales, and marketing) as well as external customers and suppliers to support product performance, customer adoption, and continuous improvement initiatives.
Responsibilities:
- Test, troubleshoot and optimize processes on highly advanced semiconductor packaging equipment.
- Identify areas for technical improvement and gaps in performance.
- Identifies, analyzes and resolves system design weaknesses.
- Conduct machine buy-offs in K&S factory and, at times, at customer site.
- Analyze machine and process data to identify causes of process assists, failures or yield loss.
- Preparation of internal summary reports and customer presentations.
- Provides multi-layered technical expertise for next generation initiatives.
- Interfaces with other functional groups for troubleshooting and equipment improvement.
- Support new product introduction (NPI) projects, including process characterization, beta testing, and evaluation tool development.
- Provide timely, high‑quality technical support in response to customer requests, ensuring clear, professional, and effective communication.
- Perform other duties as assigned.
Qualifications:
- Bachelor's or Master's degree in Engineering, Physics, Materials Science, or a closely related discipline.
- At least 3 years of relevant, hands on experience in backend semiconductor assembly, including assembly packaging processes and equipment maintenance and troubleshooting.
- Ability to travel frequently in support of business and operational requirements (estimated travel exceeding 70%).
- Proficiency in Mandarin is preferred, as the role involves job‑related communication with engineers and stakeholders based in China, including coordination with customers, design engineers, and managers.
- Demonstrated technical knowledge of backend assembly processes, including Die Attach, Flip Module, Clip Attach, and Vacuum Reflow Oven processes.
- Proven experience in applying Design of Experiments (DOE) and statistical analysis techniques for process optimization and problem solving.
- Strong data analysis skills, including working knowledge of Matlab and/or JMP, Minitab
- Effective verbal and written communication skills to support cross functional and cross regional collaboration.
- Demonstrated analytical and problem solving capabilities, including the ability to propose practical and innovative solutions.
- Ability to work collaboratively in cross functional teams as well as independently with minimal supervision.
- Strong results orientation, with the ability to manage priorities and deliver outcomes in a dynamic environment.
