Job Description
Responsibility
1. Responsible for digital circuit physical implementation (RTL to GDS) and PV/PI signoff; perform full-chip STA signoff, participate in defining STA signoff standards, and conduct SPICE simulation for critical timing paths; 2. Develop, optimize, and maintain PR/PV/PI/STA design flows; support the introduction of advanced technology nodes and EDA tools; 3. Participate in PPA (Power, Performance, Area) and yield optimization, including related tool development and flow improvement.
Requirement
1. Proficient in the complete digital physical design flow (RTL to GDS) and related EDA tools (INVS, FC, PT, PX, RH, Calibre, etc.); strong expertise in STA analysis methods and flows; familiar with DC or FC synthesis processes; 2. Experience in top-level PR/PI/PV/BUMP or ESD planning is a plus; familiarity with signoff standards for advanced process nodes is preferred; proven tape-out experience with ultra-low-voltage, large-scale, or complex IP chips is a strong advantage; 3. Familiar with low-power design methodologies and power analysis flows; experience in PPA optimization preferred; 4. Strong programming skills in one or more languages such as Tcl, Python, Perl, C, or C++; 5. Familiar with 3D IC design; relevant experience is a plus; 6. Prior experience with STA signoff in tape-out projects is preferred.
More Info
Key Skills
STA analysis methods
FC synthesis
3D IC design
low-power design methodologies
signoff standards
ESD planning
digital physical design flow
STA signoff
power analysis flows
tape-out experience
PPA optimization
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