Position Summary
Package Design Manager (BGA & Substrate & WLCSP) is responsible for management of product and tooling design.
Candidates with management of wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.
Key Responsibilities
- Lead packaging design team.
- With reference to internal design guidelines, work with the internal & external customer to:
- Generate, update, and revise electrical routing layout based on the netlist or design provided by external customers.
- Generate test vehicle design and the related PCB design.
- Prepare design risk assessment report.
- Generate reticle and stencil design.
- Generate other schematics or drawing asrequested.
- Review,maintenance and update the design guidelines.
- Manage the conversion of internal design into suppliers final design.
- Document all the drawing revisions and change records.
- Support audits
- Any other ad-hoc duties as assigned
Requirement
- Manage packaging design team.
- 510years hand-on experience of using Cadence APD in RDL routing and mask design for wafer-level processes including Wafer bumping, WLCSP, BGA, eWLB and other fan-out processes. Other similar experience could be considered if relevant.
- Good understanding on the design guidelines and familiar in generating risk assessment report based on Fan-in/ Fan-out process capability.
- Familiar with other design software like Link cad, CAM350, AutoCAD, GDS editor and Gerber editors.
- Familiar with PCB test board design.
- Knowledge and understanding of wafer-level process and product reliability as well as other packaging assembly process will be the advantage.
