Engineer, Tapeout Engineering

About GlobalFoundries

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit .

Introduction

As a Tapeout Engineering (D2P) Engineer, you will play a key role in supporting semiconductor mask data preparation and tapeout activities. This role involves contributing to layer generation, OPC/ORC integration, and endtoend tapeout flows while ensuring quality, consistency, and risk mitigation across manufacturing and digital application processes.

You will work closely with Product Owners, Business Analysts, Developers, DevOps teams, and semiconductor engineering teams, gaining handson experience in pretapeout and tapeout support while building strong foundations in agile quality engineering, software validation, and digital transformation initiatives.

Responsibilities

• Support semiconductor mask data preparation and tapeout activities, including layer generation and integration of OPC and ORC processes.

• Collaborate with crossfunctional teams to support pretapeout design flows, frame generation, and endtoend tapeout schedules to meet customer requirements.

• Assist in problem solving, planning, and testing across the tapeout and mask build flow to ensure accurate and ontime photomask delivery.

• Participate in continuous improvement and automation initiatives to enhance tapeout and mask data preparation workflows.

• Assist in evaluation, testing, and adoption of new software tools and workflow enhancements.

• Work within Agile delivery teams to support embedded quality engineering activities during sprintbased development.

• Collaborate with Product Owners and Business Analysts to refine user stories and acceptance criteria for clarity, completeness, and testability.

• Design and execute functional and endtoend test cases support System Integration Testing (SIT) and User Acceptance Testing (UAT).

• Validate positive and negative flows, edge cases, and basic nonfunctional requirements such as performance and security awareness.

• Identify requirement gaps, inconsistencies, and risks early, providing technical feedback under senior guidance.

• Log, track, and triage defects contribute to root cause analysis, quality metrics, and continuous improvement initiatives.

• Provide technical support to field engineering, customer engineering, and process owners as needed.

• Proactively anticipate customer needs and assist in capacity planning to support tapeout requirements.

• Perform all activities in compliance with Environmental, Health, Safety, and Security (EHS&S) requirements and programs.

• Collaborate on additional projects or assignments as required by the organization.

Required Qualifications

• Bachelor's Degree in Engineering, Computer Science, Electronics, Electrical Engineering, or a related technical discipline.

• Experience or strong interest in semiconductor manufacturing flows, mask data preparation, or tapeout processes.

• Foundational knowledge of photomask generation, OPC/ORC concepts, and pretapeout design flows.

• Exposure to Agile or DevOps environments, with understanding of sprintbased development and quality engineering practices.

• Experience designing and executing functional and endtoend tests, defect tracking, and test documentation.

• Familiarity with software validation, workflow automation, or digital transformation initiatives is a plus.

• Strong analytical and problemsolving skills with attention to detail and process quality.

• Effective communication skills with the ability to collaborate across engineering, product, and manufacturing teams.

• Ability to work effectively in evolving environments and adapt to changing priorities.