Engineer, R&D Process Development (Lid Attach/ Laser Mark)

Job Description

• Drive process and machine improvement, including the implementation of specific process enhancement.
• Support and manage customer engineering build activities.
• Plan, execute and document DOE activities, including report submission & presentation.
• Conduct failure analysis and root cause investigation, report preparation & presentation.
• Work with third party and identify solutions to enhance capabilities.
• Coordinate all customer engineering and qualification builds with cross-functional factory teams to optimise resource utilisation.
• Monitor & track the progress of key deliverables to achieve defined Key Milestone and Success Criteria including regular communication with customers.

Requirement

• Bachelor's degree in Material Science, Applied Physics, Mechanical Engineering or related engineering discipline.
• Experience in high volume electronics manufacturing environment preferably semiconductor or module assembly.
• Must be familiar and have hands-on experience with the process and machines for Lid Attach/ Laser Mark.
• Familiar with JMP data analysis capability.
• Strong expertise in root cause analysis and problem-solving methodologies.
• Knowledge and experience on multiple process of the above will be an advantage.
• Proven experience in assembly FOL/ EOL process (at least 5 years experience).