Drive process and machine improvement, including the implementation of specific process enhancement.
Support and manage customer engineering build activities.
Plan, execute and document DOE activities, including report submission & presentation.
Conduct failure analysis and root cause investigation, report preparation & presentation.
Work with third party and identify solutions to enhance capabilities.
Coordinate all customer engineering and qualification builds with cross-functional factory teams to optimise resource utilisation.
Monitor & track the progress of key deliverables to achieve defined Key Milestone and Success Criteria including regular communication with customers.
Set & monitor the KPI for the team base on underfill development projects.
Requirement
Bachelor's degree in Material Science, Applied Physics, Mechanical Engineering or related engineering discipline.
Experience in high volume electronics manufacturing environment preferably semiconductor or module assembly.
Must be familiar and have hands-on experience with either one of the following process and machines (SMT/ Flux Clean, Flip Chip/ TCB, Underfill, Lid Attach/ Laser Mark, Ball Mount/ AOI).
Familiar with JMP data analysis capability.
Strong expertise in root cause analysis and problem-solving methodologies.
Knowledge and experience on multiple process of the above will be an advantage.
Proven experience in assembly FOL/ EOL process (at least 5 years experience).
