Introduce WLCSP new devices into mass production(concept, design, verification, validation, and manufacturing releases of new products)
Lead and manage new product, ensure on time delivery as committed with the customer
Works and communicates with customers to understand qualification requirements and expectations of the new product
Translate customer's engineering build instructions to Special Work Request
Review and delegate external specifications from customers pertaining to each device/product to relevant team
Coordinate with Design and Process Engineering Team on the action items to ensure product is within the site capability and manufacturing flow
Publishes and reviews engineering reports, including all issues found and resolved during developments, as well as yield reports and analysis.
Makes smart and sound decisions to support quick turn around on sample and engineering builds
Maintains lifecycle/document management from Qualification to Production lifecycle phase thru eNPI system.
Attends daily meeting to check NPI builds movement and issues encountered during processing and coordinate with Support Group for help needed on execution
Requirements:
Degree/Diploma in Electrical/Electronic Engineering or equivalent
Minimum 5 years experience in WLCSP/Backend Process/Product/Package Engineering in Semiconductor industry or equivalent preferably from OSAT
Strong project coordination, communication, and problem-solving skills
