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Associate Engineer, Process

Associate Engineer, Process

silicon box pte. ltd.
0-2 Years
SGD 2,800 - 4,800 per month
Early Applicant
  • Posted 24 days ago
  • Be among the first 10 applicants

Job Description

Position Summary

The Process Associate Engineer willbe responsible to support the organisation's Product Development and NewProduct Introduction activities reliably and efficiently. Candidates withrelated experience in Semiconductor and LCD processes are encouraged to applyfor this position.

Responsibilities

Assist Engineers in:

  • Process recipe setup and qualification for production
  • Process monitoring and improvement.
  • Troubleshoot process-related issue.
  • Perform lots on hold and disposition
  • Engineering data collection
  • Other ad-hoc activities.

Support production line by:

  • Ensuring that process integrity for machines is in place forproduction.
  • Maintaining good housekeeping in the production area,
  • Co-ordinating with line operators/supervisors to ensure thatwork is carried out efficiently to meet module objectives and thatSOPs are strictly followed.

Requirements

  • Diploma in Electrical/ Electronics/ Mechatronics/Mechanical/ Microelectronics Engineering or similar disciplines
  • No work experience required training will be provided
  • Prior experience in the following areas in a semiconductor manufacturing environment would be advantageous:
  • Die preparation/ recon (backgrind, dicing, laser-grooving, pick and place, molding) processes
  • PVD (sputtering), chemical wet etching/ cleaning, lithography processes
  • Backend (ball mounting, ball drop, reflow, laser marking, package sawing, TnR) processes
  • Prior experience in manufacturing documentation of SPC, WI,SOP, FMEA, etc would be advantageous
  • Able to work under various shift patterns. Selected candidates will start with normal office hours, and eventually transition to 12-hour shifts

More Info

Job Type:
Industry:
Employment Type:

Key Skills

Recon

Chemical wet etching

Backend ball mounting

Ball drop

Die preparation

Laser-grooving

Molding processes

Reflow

Package sawing

TnR processes

Backgrind

Pick and place

PVD sputtering

Lithography processes

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