laser marking , Wi, Fmea, Spc, SMD, Backend Processes, Reflow, MBB, Tray, Ball mounting, Sop, Packing, Pick and Place, TnR, Smt, Package Sawing

Process Optimization, SPC data analysis, Equipment interaction, Data Analysis, Root Cause finding, Process monitoring control, New process product qualification, Cross-functional work, Process control limits, Process troubleshooting, DOE process parameters

promis , measurement instruments, Ms Office Applications, SPC charts

Testing, ocap, Encapsulation, CQM, ISO14001 2004, Fmea, Spc, Maintenance of die attach wire bond encapsulation and testing machinery, ESEC ASM KNS wire bonders, IC assembly processes, Wire bond, ISO9001 2000, Die attach, Copper wire bonding, Doe, JEDEC, QEMS