cmp , failure-analysis methods, Data Analysis, Etching, wafer thinning, process integration, Plating, Spc, lithography, deposition, Bonding, bumping, wafer fabrication, advanced packaging, RDL, Doe, package assembly development

problem diagnosis, troubleshooting methodologies, maintenance, Data Collection, Machine Operation, Analysis

Data Analysis, process integration optimization, Simulation Software

MATLAB, Python, Fea, Cfd, Semiconductor processing, Motion control systems

semiconductor process , Verilog, System Verilog, Data Analysis, VHDL, Vlsi, Statistical Tools, Schematic Simulation Data Analysis, device physics, Pattern Manipulation, Lab Debug

SAP, Power Bi, Microsoft Excel, Oracle, Python