Job Description

Job Highlights

Develop next-generation advanced packaging and chiplet integration technologies
Opportunities across FOWLP, 2.5D/3D integration and advanced bonding
Work on R&D, prototype development and industry collaboration projects

We are recruiting engineers for multiple opportunities in advanced semiconductor packaging and process integration.

If you have experience connecting semiconductor process modules, developing integration flows, or resolving cross-process issues to improve yield and reliability, we would like to hear from you.

Key Responsibilities

Develop and optimize process integration flows for advanced packaging technologies, including fan-out wafer-level packaging, 2.5D interposers, 3D stacking and heterogeneous integration.
Work across relevant process modules such as lithography, deposition, plating, etching, CMP, RDL, bumping, wafer thinning and bonding.
Assess interactions between upstream and downstream processes to improve integration compatibility and overall package performance.
Plan and execute engineering experiments, short-loop evaluations and prototype builds.
Investigate process defects, yield losses and reliability issues using structured root-cause analysis.
Collaborate with design, process, equipment, manufacturing and reliability teams to deliver technical milestones.
Document process flows, experimental findings and technical reports, and support discussions with industry partners.

Requirements

Bachelor's, Master's or PhD in Electrical/Electronics Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, Physics or a related discipline.
Relevant experience in semiconductor process integration, wafer fabrication, advanced packaging or package assembly development.
Experience integrating multiple process steps, with an understanding of how individual modules affect downstream processes, yield or reliability.
Hands-on process development, experimentation and troubleshooting skills.
Familiarity with DOE, SPC, data analysis or failure-analysis methods.
Ability to work across technical teams and communicate findings clearly.

Relevant Technical Backgrounds

Experience in one or more of the following areas would be valuable:

FOWLP, fan-in/fan-out packaging or wafer-level packaging
RDL, wafer bumping or Cu back-end integration
TSV, interposers or 2.5D/3D integration
Flip-chip, thermal compression, fusion or hybrid bonding
Chip-to-wafer or wafer-to-wafer integration
Assembly integration involving thinning, dicing, underfill or moulding
NPI, prototype development, process transfer or manufacturing ramp-up

Candidates are not expected to have experience in every technology listed. Strong expertise in a relevant area, supported by cross-module integration experience, will be considered for suitable openings.

How to apply: