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Singapore

Skills:

analytical modelling , MATLAB, Python, Backside power delivery, Frequency-dependent interconnect modelling, Power integrity analysis, Equivalent-circuit modelling, Hybrid bonding, Redistribution layers, Electro-thermal modelling, Co-packaged optics, S-parameter measurements, Time-domain reflectometry, Circuit Simulation, PDK and model library development, Electromagnetic parameter extraction, Model extraction and validation, Signal integrity analysis, Numerical Analysis, TSVs, Electrical performance evaluation, Electrical test structures, Measurement de-embedding, 3D ICs

Early Applicant
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