laser marking , Wi, Recon, Chemical wet etching, Backend ball mounting, Ball drop, Fmea, Die preparation, Spc, Laser-grooving, Molding processes, Cleaning, Reflow, Package sawing, Sop, TnR processes, Backgrind, Dicing, Pick and place, PVD sputtering, Lithography processes

promis , measurement instruments, Ms Office Applications, SPC charts