wafer bonding , cmp , Dashboarding, Data Analytics, Visual Basic, Process Modeling, Python, Statistical Analysis, Sql, Spc, Defect analysis, Dry etch, RMS Recipe Management System, R, photolithography, Doe, sims, EDX, Xps, Deposition, E3 FDC Fault Detection and Classification, Process interactions, Process Control, Process flows, Wafer thinning, Wet process, TEM, Sem, Plating

3d packaging , RDL processes, Control Plan, Fmea, interconnect technologies, Heterogeneous Integration, design of experiment, Bonding, advanced packaging process verification, Qualification, bumping, bump underfill molding, Doe, Molding, dicing

Data Analytics, Visual Basic, Dashboarding, Python, Sql, R, Spc, E3 FDC, Doe, defect analysis, RMS Recipe Management System