Senior Engineer, APTD CEM - Advanced Packaging Wafer Level Technology Engineering

Role Summary:

We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron's Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration flows for solutions that drive the future.

Main Responsibilities:

Process Development:

• Establish and improve process management projects to deliver technology node requirements and scaling for next node for wafer level process conditions and technologies including photolithography, dry etch, CMP, wet process, deposition, plating, wafer bonding and wafer thinning.

• Identify disruptive processes early on and work with manufacturing to identify viable path forward

• Process development will include performing fundamental research, hardware evaluations, as well as testing processes for novel applications and generating intellectual property relevant to Micron.

• Initiate and manage experiments to widen process margins as well as to test out manufacturability of next node solutions

• Design and implement advanced process monitoring and control methodologies.

• Lead team or sites or suppliers on complex, multi-disciplinary projects in quality focused meetings, process and yield improvement meetings, cost and productivity improvement meetings

Equipment and Materials:

• Evaluate and promote new equipment and materials to enhance process capabilities

• Quantify benefits of innovative process and/or equipment solutions to enable early experimentation and adoption for process margin improvement

Quality Improvement:

• Ensure defense coverage through process, measurement, inspection, and testing

• Establish correlations between defense mechanisms to identify improvement opportunities

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

• Integrate and troubleshoot processes as part of cross-functional teams driving yield and quality improvement

Collaboration and Coordination:

• Requires global collaboration across Singapore, Boise, and Taiwan sites

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives

• Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control

• Ensure smooth transition from new product development, qualification, small volume production to high volume production

• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities

AI Responsibilities:

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one's scope of work.

Candidate Profile
Minimum Required Qualifications:

• PhD, or Master's degree with ≥3 years, or Bachelor's degree with ≥5 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or a related field.

• Semiconductor process development, preferably in wafer bonding, plating, warpage control and packaging field.

• A deep understanding of chemistry, chemical kinetics, thermodynamics, mass transport, physical phenomena.

• Deep understanding of films and interface engineering and analysis techniques thereof - SIMS, XPS, EDX, SEM/TEM.

• Proven ability to collaborate with local and overseas teams on projects

• Excellent oral and written communication skills with ability to convey the message in concise and effective manner both in local as well as remote communications.

• Ability to be a self-motivated individual and be adaptable to Micron's changing needs in terms of working extended hours, if required

• Proven ability to work in a demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously

Must Have Technical Skills:

• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.

• Experience with Visual Basic for automation and tool integration.

• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.

• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.

• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability

Must Have Soft Skills:

• Strong analytical and problem-solving capabilities.

• Outstanding communication, leadership, and stakeholder management skills.

• Ability to work independently and collaboratively in a fast-paced environment.

• Ability to work cross-functionally with process, equipment, and reliability teams.

AI Requirements:

• Ability to apply baseline digital fluency and role‑appropriate AI literacy to use AI‑enabled tools responsibly and effectively for research, analysis, content creation, problem‑solving, operational tasks, and achieving business outcomes.

Embody Micron's core values:

• People - Respect, develop, and empower others

• Innovation - Drive continuous improvement and breakthrough thinking

• Tenacity - Show grit and determination

• Collaboration - Build trust and foster teamwork

• Customer Focus - Deliver excellence and value

• Speed - Act with purpose and set the pace