Excel, Post market surveillance analytics, iso standards, Lean, Materials, Quality System Regulations, Powerpoint, Gmp, Ms Word, Electronic and electrical components, Six Sigma methodologies, Mechanical Design, Manufacturing Process, Electronic design technologies, 5S

Root Cause Analysis, Fmea, Spc, Statistical Tools, Autocad, Six Sigma, 8D

Industry reliability test methods, Analytical Skills, Fmea, Semiconductor package assembly, Assembly Engineering, Product Quality and Reliability Engineering, Sampling statistics, Hygroscopic stress effects, Packaging Technology, 8D, Acceleration models

Analytical Skills, Industry reliability test methods, Semiconductor package assembly, Fmea, Assembly Engineering, Product Quality and Reliability Engineering, Sampling statistics, Hygroscopic stress effects, Packaging Technology, 8D, Acceleration models

Visual Inspection, Quality Management, Root Cause Analysis, semiconductor processes, inspection tool recipes, quality standards, Risk Assessment, Documentation

GDPMDS, Iso 13485, Lean, Iso 9001, Gmp, Lead Auditor certification, Six Sigma, GDP, Root Cause Analysis