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8,000 SGD 14,000 SGD
Manufacturing(Electronics/Semiconductors)
Our client is launching a new business and establishing a new factory in Singapore. They are seeking an experienced Wet Etch Process Engineer to join their team and contribute to advanced packaging solutions.
Responsibilities
Process Development & Optimization
-Develop and optimize wet etching processes for substrate layers.
-Design experiments (DOE) to evaluate and improve critical etch parameters (e.g., etch rate, uniformity).
-Establish and maintain robust process windows for R&D and volume production.
Equipment & Materials Management
-Define equipment requirements and manage tool qualifications (e.g., acid/ultrasonic cleaning, wet benches).
-Monitor and maintain etching tool performance, chemistry concentration, and bath lifetime.
-Evaluate and select etchants, and chemistry blends suitable for advanced substrates.
Yield, Quality & Defect Control
-Identify and resolve etching-related defects such as over-etch, or residues.
-Analyze root causes of defects using SEM, optical inspection, and profilometry tools.
-Collaborate with upstream/downstream processes to improve overall line yield and substrate performance.
Cross-Functional Collaboration
-Work closely with plating, lithography, CMP, and lamination teams to ensure seamless process integration.
-Support new product introductions (NPI) and customer qualifications with process stability and repeatability.
Documentation & Compliance
-Create and maintain technical documentation such as process specifications, control plans, FMEAs, and work instructions.
-Ensure processes comply with environmental, safety, and chemical handling regulations.
Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.
Requirements & Preferences
(Must)
-PhD or Master's degree in Chemical Engineering, Materials Science, Microelectronics, or related field.
-5-10+ years of hands-on experience in substrate, PCB, or semiconductor etching processes.
-Familiar with substrate materials such as ABF, PID, PI, or photoresists.
-Knowledge of Damascene/SAP processes for high-density substrates.
-Proficiency with process characterization tools (SEM, AFM, XPS, optical profilers).
-Familiar with SPC, Six Sigma, and yield enhancement methodologies.
(Advantageous)
-Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding is a plus.
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What you will receive
- AWS
- Variable Bonus (based on company and individual performance)
- Annual Leave: 16 days (up to a maximum of 20 days)
- Medical Leave
- Family care leave (2 days/year)
- Dental care
- Company phone will be provided
8:00 17:00
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As one of the leading Japanese Recruitment Agencies in Singapore, Reeracoen Singapore offers professional recruitment solutions extending across temporary, contract, permanent and outsourcing to the Singapore workforce. We take pride in our solutions provided to our business partners, assisting not only job seekers in finding suitable employment but also supporting business enterprises in talent acquisition.
Job ID: 134415329
