Position title : TCB (Thermo Compression Bonding) Process Engineer
Location: North
Working Days: 5 Day A Week
Working hours : 9:00am - 6:00pm
Salary : $5000 - $8000 (depends experience)
Interested applicants can also send your resume to WA:+65 8839 3566 (Ms Angel) and allow our Consultant to match you with our Clients.
No Charges will be incurred by Candidates for any service rendered.
LIEW ONN KEE REG NO : R22108518
THE SUPREME HR ADVISORY EA NO:14C7279
Responsibilities:
- Develop and optimize TCB process parameters for flip chip or die-to-substrate bonding.
- Evaluate new materials (e.g. underfill, bumps, substrates) and bonding tools to improve process performance and reliability.
- Troubleshoot and resolve yield issues related to TCB bonding such as non-wet, misalignment, voids, delamination, or warpage.
- Define and maintain process documentation, control plans, and standard operating procedures (SOPs).
- Conduct DOE (Design of Experiments) and data analysis to validate process changes and drive process improvements.
- Work closely with equipment vendors to install, qualify, and maintain bonding tools (e.g., bonder heads, stages, temperature/power controls).
- Support NPI (New Product Introduction) and technology transfers from R&D to production.
- Collaborate with quality, reliability, and failure analysis teams for process qualification and root cause analysis.
- Ensure process stability and repeatability in volume manufacturing through SPC and inline monitoring.
- Maintain compliance with environmental, health, and safety standards.
- Experience on HBM, COWOS, 2.5D is a definite plus
- Experience on N2 Environment is added advantage
Requirements:
- Bachelor's or Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
- Minimum 2-5 years of hands-on experience in semiconductor packaging or advanced interconnect processes.
- Experience with TCB or similar bonding technologies (thermo-sonic, thermocompression, eutectic bonding) is highly preferred.
