- Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)
- Location: 8 Admiralty Street #06-13, Singapore 757438
- Working Days: 5 Day A Week
- Working hours : 9:00am - 6:00pm
- Salary : $6000 - $8000 (depends experience)
Role Overview
We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The candidate should have hands-on experience in ejecting ultra-thin dies (down to 25 m) from wafers and familiarity with Chip-on-Wafer (CoW) package handling for CoWoS assembly. This role demands a deep understanding of stress, warpage, and material behavior during the ejection process to achieve high yield and prevent die damage.
Key Responsibilities
- Lead the design of die ejection modules capable of handling ultra-thin dies ( 25 m).
- Develop mechanical tooling and systems to minimize stress, die cracking, or chipping during ejection.
- Incorporate simulation-based validation (FEA) for warpage, stress, and deformation analysis.
- Design ejection solutions that effectively mitigate residue-related yield loss from wafer dicing tape.
- Collaborate with motion, control, and vacuum subsystems to ensure synchronized ejection and pick-up.
- Work closely with process engineers to optimize ejection force, tape adhesion parameters, and throughput.
- Design ejector modules for large and warped CoW packages used in CoWoS and 2.5D packaging applications.
- Develop robust tooling concepts to manage thermal and mechanical stress during CoW ejection.
- Analyze yield loss due to ejection-related defects and implement design or process improvements.
- Support cross-functional teams in root-cause analysis and failure prevention.
Requirements
- Bachelor's or Master's degree in Mechanical Engineering, Mechatronics, or related field.
- 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems.
- Strong background in mechanical stress analysis, warpage modeling, and precision tooling design.
- Proficiency with SolidWorks, Creo, or equivalent 3D CAD software.
- Experience with FEA tools (ANSYS, COMSOL, etc.) for stress and deformation analysis.
- Familiarity with cleanroom design requirements, vacuum systems, and precision motion stages.
- Prior involvement in CoWoS, 2.5D, or HBM packaging processes.
- Hands-on experience with tape residue management, die pick-up optimization, or die attach automation.
- Knowledge of wafer dicing, plasma cleaning, and surface preparation techniques.
- Experience collaborating with process, electrical, and software teams in semiconductor tool development.
Samuel Siaw
The Supreme HR Advisory Pte Ltd
EA No: 14C7279
Reg No: R2412474
