Staff/Principal Engineer, NAND TD, RDA

Required Responsibilities

. Own the site-level RDA strategy and annual roadmap aligned to NAND TD technology nodes.

. Lead analysis of experimental and production flows to detect, classify, and trend systematic and random defects.

. Establish, track, and report program health metrics (baseline health, detection rates, false positives, MTTR).

. Direct fast containment for defect excursions: trigger tool quarantines, define hold criteria, and lead 8D corrective actions.

. Architect inspection recipes and sampling strategies optimize sensitivity, throughput, and cost of ownership.

. Partner with Process Integration, Yield, and Data Science to correlate inspection signals to device performance and yield.

. Influence supplier roadmaps evaluate, qualify, and release next‑gen optical/e-beam inspection capabilities.

. Standardize and disseminate Best Known Methods (BKM) across global TD and manufacturing sites.

. Mentor, coach, and upskill engineers develop succession plans and technical ladders within the RDA domain.

. Champion safety and continuous improvement (CIP) drive kaizen/lean initiatives that improve cycle time and learning velocity.

Key Responsibilities

. Serve as the technical lead for RDA methodologies and execution within NAND TD.

. Perform root cause analysis using statistical, image-based, and data-driven techniques.

. Develop, own, and communicate inspection and defect detection technology roadmaps.

. Define program health metrics and drive continuous improvement initiatives (CIP).

. Lead tool anomaly investigations, quarantine decisions, and corrective action planning.

. Collaborate globally to align Best Known Methods (BKM) across sites.

Stakeholder Collaboration

. Technology Development (TD) Process and Integration teams

. Yield Analysis and Data Science organizations

. Global Manufacturing and Operations

. Inspection/metrology equipment suppliers

. Program and engineering leadership across regions

Required Qualifications

. Bachelor's degree with 7+ years relevant semiconductor experience, or Master's/PhD with 5+ years.

. Minimum 3+ years hands-on RDA experience in semiconductor manufacturing or equipment engineering.

. Demonstrated expertise in defect inspection, process monitoring, and yield learning.
Technical Competencies

. Realtime Defect Analysis (RDA) systems and workflows.

. Optical and e-beam inspection technologies.

. Statistical data analysis, correlation development, and large dataset interpretation.

. Semiconductor process integration and technology development.

. Root cause analysis and systematic problem solving (e.g., 8D, DMAIC).

Leadership & Behavioral Competencies

. Recognized technical authority with the ability to influence without direct authority.

. Strong mentoring and coaching mindset with proven talent development outcomes.

. Clear, concise communication skills across technical and executive audiences.

. Ownership-driven, execution-focused comfortable operating in ambiguity.

Impact & Success Measures

. Reduced defect-related yield loss and faster learning cycles.

. On-time qualification and adoption of next-generation inspection capabilities.

. Uplift in organizational RDA skill depth and succession pipeline.

. Alignment of inspection strategy and capability to future NAND nodes.