Job description
Job Description:
. Lead the Equipment Section to maintain high team morale and deliver strong KPIs and sustainable long-term performance.
. Ensure compliance with MRB, TECN, 8D, specifications, and QMS tools (SPC, FMEA) to enable timely issue detection and effective resolution.
. Drive risk management and continuous improvement initiatives to prevent quality, yield, and excursion issues. . Define targets and lead improvement projects to reduce wafer scrap, defects, and rework, while improving process capability.
. Track and ensure project execution aligns with fab performance and operational requirements.
. Forecast and manage equipment repair and management budgets while driving cost optimization initiatives. . Collaborate with Process and Manufacturing teams to resolve equipment constraints, improve OEE, and optimize metrology sampling.
. Manage vendor performance to enhance quality, cost efficiency, and service support.
. Ensure full compliance with EHS standards and maintain high housekeeping practices.
. Oversee spare parts inventory control and forecast usage to ensure availability and cost efficiency.
. Set clear performance expectations, conduct regular reviews, and support team capability development and career progression.
. Ensure effective training, competency development, and proper documentation of technical knowledge
. Requirements:
. Degree in Electrical / Electronics / Mechanical / Mechatronics / Microelectronics Engineering
. 8 years of relevant work experience in Thin Film CMP Equipment.
. Min 5 years of proven track record in a managerial role with strong leadership capabilities.
. An excellent team player with good interpersonal, communication and written skills
. High level of integrity with strong leadership attributes to lead and coach a team
. Highly committed with good ownership and accountability
. Able to adapt in a fast-paced environment and work under pressure
. Proficient in MS Office Applications and good data analytical skill.
