. Analyze SPC charts using SPACE. Know all the PR rules and their significance. Do proper annotation to maintain quality troubleshooting rate for SPC OOC. Understand Cp and Cpk indices.
. Monitor critical SPC charts daily. Perform process window study and provide improvement plan to reduce OOC and improve CPK.
. Review ESPC charts using SPACE. Know all the rules for ESPC.
. Analyze split lot, DOE data, ET, sort yield using JMP, Klarity ACE.
. Create SPC charts, DCOP and modify SLDB using PROMIS (Si-View).
. Upload recipe, check recipe and ensure recipe content compliance using RMS.
. Raise PCRB and understand the requirement for PCRB opening, follow through with qual plan, analyze data using required software and CR closure.
. Follow up on SPSR, MRB, 8D, TECN, or spec update with ECN.
. Setup and troubleshoot in recipes/ job files in all metrology tools within the Module.
. Follow up on passdown to troubleshoot process issues. Establish CAS / procedures to be followed and work with other departments for resolution if required.
. Startup and qualify new process and new equipment within scheduled timeline. Work closely with Equipment Engineer on new equipment acceptance. Know the concept of repeatability and reproducibility (R&R) run.
. Work on reducing process constraint so that Mfg can have more flexibility.
. Perform process matching between equipments to reduce variation and analysis / DOE to find factors for better tool matching.
. Participate in CIP programs to optimize process window, cost, yield, and productivity.
. Work as a team with both Equipment and Mfg Engineers to meet Module objectives. Work to meet the key indices of Uptime and OEE goals.
. Represent own Module to attend cross-functional task team to address yield improvement/ excursion issues. Follow up with cross-fab benchmarking activities to engage the best-in-campus practices across fabs.
. Self-audit and update specifications/ documentation to meet TS16949 Quality Standard requirements.
. Follow good housekeeping and safety rules in office and FAB.
. Provide feedback/ training to AEs or Techs on their troubleshooting skills, understanding of processes, decision making, risk assessment.
. Set Expectations for AE as instructed by Section Manager.
. Provide monthly report to Supervisor.
. Participate in wafer scrap reduction. Ensure no human error.
. Responsible and accountable for complying with and implementing environmental, health, safety and security (EHSS) system, policies, procedures and guidelines that are applicable to your scope of work, thereby maintaining a healthy and safe workplace.
. Strong understanding of epitaxial growth principles: Homoepitaxy vs. Heteroepitaxy, selective epitaxy, and stress engineering.
. Familiarity with RTP processes and metrology techniques for epi layer characterization.
. Proficiency in SPC tools (SPACE, JMP) and FMEA analysis.
. Knowledge of wafer fabrication flow and interaction with other modules.
Preferred Qualifications
- Bachelor's or Master's in Materials Science, Chemical Engineering, or related field.
- Experience in semiconductor epitaxy processes (Example: SiGe) 1-2 years
- Hands-on experience with epitaxy tools (e.g., ASM Epsilon, AMAT platforms).
- WSQ-certified or equivalent training in epitaxy process management.
Information about our benefits you can find here:
