SMTS Integration Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration)

• Lead Integration Activities: Oversee and manage the integration of 2.5D and 3D heterogeneous integration technologies, ensuring seamless collaboration between design, process, and manufacturing teams.
• Technical Expertise: Provide technical guidance and expertise in 2.5D and 3D packaging processes, materials, and equipment. Stay current with industry trends and advancements.
• Project Management: Develop and maintain project plans, timelines, and budgets. Coordinate with cross-functional teams to ensure project milestones are met.
• Process Development: Drive the development and optimization of 2.5D and 3D heterogeneous integration processes, including interposer design, through-silicon vias (TSVs), die stacking, and thermal management.
• Quality Assurance: Implement and monitor quality control measures to ensure the highest standards of product reliability and performance.
• Collaboration: Work closely with R&D, design, and manufacturing teams to integrate new 2.5D and 3D packaging solutions into production. Foster a collaborative and innovative environment.
• Documentation: Prepare and maintain detailed technical documentation, including process flow diagrams, work instructions, and validation reports.
• Problem Solving: Identify and resolve technical challenges related to 2.5D and 3D packaging integration. Implement corrective actions and continuous improvement initiatives.
• Training and Mentorship: Mentor junior engineers and technicians, providing guidance and support in their professional development.
• Compliance: Ensure all packaging processes comply with industry standards and regulatory requirements.

Qualifications

• Education: Bachelor's or master's degree in electrical engineering, Materials Science, Mechanical Engineering, or a related field.
• Experience: Minimum of 10 years of experience in semiconductor packaging, with at least 5 years in a leadership role, specifically in 2.5D and 3D heterogeneous integration technologies.
• Technical Skills: In-depth knowledge of 2.5D and 3D heterogeneous integration technologies, including interposer design, TSVs, die stacking, and system-in-package (SiP).
• Project Management: Proven track record of managing complex projects with cross-functional teams.
• Problem Solving: Strong analytical and problem-solving skills. Ability to troubleshoot and resolve technical issues efficiently.
• Communication: Excellent verbal and written communication skills. Ability to convey technical information clearly and concisely.
• Team Player: Demonstrated ability to work collaboratively in a team environment. Strong leadership and mentorship skills.
• Innovation: Passion for innovation and continuous improvement. Ability to drive new ideas and technologies forward.
• Quality Focus: Commitment to maintaining high-quality standards in all aspects of the job.
• Adaptability: Ability to adapt to changing priorities and work effectively under pressure.