About this role:
Support application validation activities across PDP, CD, and TD projects to ensure robust product performance and reliability. Generate comprehensive engineering data to facilitate customer presentations and demonstrate the capabilities of new products.
Job Responsibilities:
- Non-Pressure Silver Sinter Paste Development support and Application Validation from PDP G2 to G5
- Conducting TIM1 paste application validation for product development from PDP G2 to G5
- Leading the Best-Known Methodology project for subject matter experts in NP sinter paste and TIM1
- NP Ag Sinter paste CD project application test validation from Stage B to C
- Collaborating on projects related to functional excellence.
- Training new engineers and sharing knowledge across sites
- Preventive maintenance of equipment and spare parts/ inventory of test materials
- Execute stencil printing, dispensing, die attach, flip chip bonding, flux dipping, and reflow processes using appropriate test methodologies for newly developed solder and non-pressure sinter paste products.
- Optimize process parameters for dispensing, stencil printing, die attach, and flip chip bonding equipment.
- Provide technical support to internal teams and external customers during new product implementation.
- Apply scientific and Six Sigma methodologies to troubleshoot and solve technical challenges.
Job Requirement:
- Master or Bachelor's degree in engineering (Materials, Mechanical, Electrical & Electronics, Physics, or Chemistry preferred).
- Minimum 5 years of experience in solder/assembly materials for semiconductor applications.
- Proficiency in standard business and engineering tools (e.g., JMP, Minitab, SPC, DOE, 5-Why, 5M+1E, etc..) and Microsoft Office applications.
- Hands-on experience with equipment such as ASM DEK printer, ASM SiPlace, Besi Datacon, ESEC Die Bonder, and Musashi dispensing platforms is highly desirable.
- Strong presentation skills and an innovative mindset.
