Senior Reliability Engineer ( Chip‑to‑Package Interaction)

About GLOBALFOUNDRIES

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets For more information, visit

Introduction

Summary of Role:

To further strengthen our Chip-to-Package Interaction (CPI) team, we are seeking a highly skilled and motivated Reliability Engineer specializing in the evaluation and qualification of BEoL (Back-End-of-Line metallization) reliability within the context of chip‑package interaction. In this role, you will collaborate with an interdisciplinary, global team and contribute to the development of next‑generation semiconductor technologies. The position is based at GlobalFoundries Singapore facility.

Essential Responsibilities:

• Support the development and qualification of new technologies and features through comprehensive CPI reliability studies.

• Plan, coordinate, execute, and evaluate reliability experiments, including failure analysis, root-cause investigation, and definition of corrective actions.

• Define, specify, and release test structures and test chips for CPI reliability assessment.

• Collaborate closely with global cross-functional teams within GlobalFoundries and with external partners such as OSATs (Outsourced Semiconductor Assembly and Test providers), test hardware vendors, and reliability service providers.

Your profile

• Master's or Bachelor's degree in Physics, Electrical Engineering, Materials Science, or a related technical discipline.

• 4 years experience in the semiconductor industry, with strong knowledge of integrated BEoL metallization processes.

• Background in reliability physics and reliability engineering, including design, testing, qualification, assessment methodologies, and design rules-preferably with a focus on BEoL metallization and semiconductor packaging processes.

• Strong understanding of statistics and probability, including the ability to apply statistical methods to reliability studies.

• Excellent problem‑solving and technical troubleshooting skills, including experience with Design of Experiments (DoE) methodologies.

• Effective communication and collaboration skills, with the ability to quickly adapt to new situations, analyze complex issues, and work independently.

• Proficiency in English, along with professional-level competency in statistical software tools (e.g., Minitab, Origin) and the Microsoft Office suite. Basic programming experience is considered an advantage.