The Process engineer plays a vital role in D2W hybrid bonding process optimization, yield improvement and to develop innovating process flow or path finding. PE Works closely between internal Hybrid team, partner and Customers.
- Responsible for process development & CIP's to improve the product yield
- To conduct DOE's and experimental process trails and data analysis
- Define new process flow for customer products and run internal feasibilities
- Provides technical subject matter expertise in the area process developments
- Understands the Hybrid bonding upstream & downstream process flow to relate actual Hybrid bonding or Fusion bonding yield related topics
- Process optimization and data analysis to improve the process responses hybrid bonding and annealing
- Supports SOP, technical documentation and product operating manual writing activities and publish BKM process flow
- Builds-up technical know-how on product/problem solving via structured knowledge transfer between the on-site support team
- Machine and Technical Support
- Machine operation and application/product setup
- Prepares and executes customer demo feasibilities and recommend the process flow
- Coordinates and provides technical solutions / problems solving on customer process related issues in collaboration with Field issues
- Investigates process issues at customer site and supports Engineering team
Education
- Master's in mechanical/electrical/Electronics /Physics or PHD
Work experience
- Minimum 5 years relevant experience in C2W or W2W hybrid bonding and Front end wafer fab/backend process
- Significant practical experience in solving process issues and process optimizations including new process setup
- Hands-on experience in semiconductor front end or backend Process and equipment's including defectivity & yield engineering
Expertise and methodology
- Good in MS-Office, data analysis SW like JMP, Matlab
- Hands-on Process Development Expertise and able to share the Problem Statement in crystal clear
