Job Responsibilities
- Process Development & Optimization
- You'll own lithography development for advanced packaging solutions.
- Developing manufacturable, repeatable, and high-yielding processes.
- Improving processes for cost reduction, cycle time reduction, and yield enhancement.
- Collaborating with cross-functional teams to lead innovations in lithography and their implementation efforts
- Drive the industry with advanced lithography solutions, for panel lithography
- Equipment & Tooling Support
- Active part of defining lithography equipment specifications and validating tools.
- Work with cross-functional team to monitor and maintain tool performance.
- Yield & Quality Improvement
- Implement and refine process monitoring techniques and defect inspection, to proactively investigate and resolve lithography defects.
- Collaborate with upstream and downstream process owners (e.g., plating, deposition, etching) to ensure seamless integration.
- Support the development of process flows for advanced packaging substrates.
- Data Analysis & Documentation
- Perform statistical analysis (e.g., DOE, SPC) to identify and control critical process parameters.
- Document standard operating procedures (SOPs), work instructions, and control plans.
- Cross-Functional Collaboration
- Work closely with design, product engineering, equipment vendors, and manufacturing teams to support process scale-up and new product introduction (NPI). Process Integration
- Assist with customer qualifications and reliability testing as needed.
- Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.
Job Requirements
Professional Qualifications:
- PhD or Master's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related field.
- 5-10+ years of experience in lithography development
Specialized Knowledge & Skills:
- Experience with defect analysis tools (e.g., optical inspection, SEM, AFM).
- Familiarity with process integration for advanced packaging (e.g., 2.5D/3D IC, interposers).
- Good analytical, documentation, and problem-solving skills.
- Good communication and teamwork in a cross-functional environment.
- Familiarity with using metrology tools for thin film and etch characterization (e.g., XRF, 4PP, ellipsometry, profilometer).
- Takes part in product risk management discussions leveraging his / her expertise and knowledge to influence and drive risk management decisions.
- Using AI/ML to enhance process discovery
- Support lithography related metrology such as CD-SEM / Filmmetrics / Inspection / Defect Review and be able to create recipes and run wafers independently.
EA License : 02C3423
EA Personnel : R22108699
