Senior Member of Technical Staff (Advanced Packaging Pathfinding)

About WhiteCrow

We are global talent research, insight and pipelining specialists with offices in the UK, USA, Singapore, Malaysia, Hong Kong, Dubai, and India. Our international reach has helped us to understand and penetrate specialist markets at a global level. In addition to this, our service is also extended to complement our client's in-house research.

About our client

Our client is a global leader in materials engineering solutions that form the foundation of virtually every new semiconductor and advanced display technology worldwide. Their innovations play a critical role in advancing AI and accelerating the commercialization of next-generation chips.

For over 55 years, the organization has been driving technological progress through breakthrough innovations that impact billions of lives globally. Powered by some of the world's brightest visionaries, engineers, and scientists, the company brings together diverse perspectives and expertise to deliver material innovations that are shaping the future of technology.

As a Senior Member of Technical Staff (Advanced Packaging Pathfinding), you will be responsible for...

Disruptive Pathfinding & Technology Development

• Driving long-range (N+2 and beyond) pathfinding exploration in advanced packaging, identifying key inflection points in interconnect scaling, materials, and integration architectures.
• Leading hands-on development and feasibility studies for novel packaging concepts, including but not limited to D2W, RDL, CoWoS, TSV, and heterogeneous integration schemes.
• Developing and validating new integration approaches, including mixed interconnect architectures, advanced bumping strategies, and next-generation substrates.
• Performing deep technical analysis and trade-off assessments to guide design, process integration, and technology selection decisions.
• Contributing to make/buy/partner evaluations through technical insights and benchmarking of emerging solutions.

Technical Innovation & Execution

• Owning key technical modules or integration challenges within pathfinding programs, driving concept-to-demonstration execution.
• Designing and executing experiments, simulations, and test vehicles to validate new ideas and reduce technical risk.
• Developing scaling frameworks and design–process co-optimization strategies to meet future performance, cost, and reliability requirements.
• Translating innovative concepts into clear technical deliverables, including models, prototypes, and demonstration vehicles.
• Documenting and communicating findings to influence technology roadmap decisions and downstream development programs.

Customer & Market Alignment

• Engaging with internal and external stakeholders to translate customer requirements and system trends, including AI, HPC, memory integration, and chiplets, into actionable technical problems.
• Identifying latent technical challenges and gaps in current packaging approaches and proposing novel solutions.
• Contributing to value proposition development by linking technical innovation to performance, cost, and scalability benefits.

Ecosystem Collaboration

• Working closely with materials suppliers, equipment teams, OSATs, foundries, and research partners to co-develop and validate new technologies.
• Supporting joint development efforts and early-stage collaborations, contributing technical expertise and insights.
• Leveraging ecosystem capabilities to accelerate learning cycles and de-risk new concepts.

Program Contribution & Technical Leadership

• Contributing to early-stage governance and decision frameworks by providing data-driven technical recommendations.
• Influencing cross-functional teams across process, product, and integration functions to align on technology direction and development priorities.
• Developing executive-ready technical narratives that clearly articulate innovation value, risks, and trade-offs.
• Mentoring junior engineers and contributing to building technical depth and an innovation culture within the team.

Leadership Expectations

• Deep Technical Expert: Demonstrating strong domain expertise in advanced packaging and integration.
• Innovation Driver: Generating and executing breakthrough ideas with measurable technical impact.
• Influencer: Driving alignment and decisions across teams without formal authority.
• Problem Solver: Thriving in ambiguity and breaking down complex challenges into actionable solutions.
• Collaborator: Effectively working across organizational and ecosystem boundaries.

What you already have...

• PhD or Master's Degree in Materials Science, Chemical Engineering, Chemistry or Physics or related field
• Research focus in semiconductor would be an added advantage
• Relevant experiences in semiconductor process development field
• Good communication and interpersonal skills
• Problem-solver attitude with determination and quality-mindset.