Senior Manager, HBM Customer Integration & System Engineering

Key Responsibilities

• Lead and develop teams responsible for customer integration, technical engagement, and system engineering.

• Drive customer technical interlocks, design reviews, escalations, and integration activities.

• Partner with design, product, manufacturing, and system engineering teams to translate customer requirements into product solutions.

• Provide leadership in HBM architecture, system integration, packaging, manufacturing, and customer enablement.

• Establish scalable engagement models, governance processes, and executive communications that enable successful customer deployment and qualification.

• Drive resolution of complex technical issues while influencing future product and technology roadmaps.

• Develops and deploys AI (artificial intelligence) systems that help automate processes and solve technical challenges.

Qualifications

• BS/MS in Electrical Engineering, Computer Engineering, or related field.

• 10+ years of semiconductor engineering, system integration, customer-facing technical leadership, or engineering management experience

• Strong understanding of HBM architecture, system integration, packaging, manufacturing processes, and customer qualification.

• Proven ability to lead global cross-functional teams and influence executive-level stakeholders and customers.

• Excellent communication, leadership, and problem-solving skills

Preferred Experience

• Customer-facing leadership experience with hyperscale, AI, networking, or semiconductor customers.

• Experience leading geographically distributed teams across Asia and the United States.

• Knowledge of advanced memory solutions, AI systems, and high-performance computing platforms.