Process Engineer (ECP / PVD) R&D
The ECP / PVD Process Engineer plays a key role in research and development by designing, developing, characterizing, and optimizing electrochemical plating (ECP) and physical vapor deposition (PVD) processes. This position involves hands-on experimental work, advanced data analytics, and close collaboration with cross-functional research teams to enable nextgeneration materials, devices, and technologies. The role also leverages AI- and data-driven tools to improve process capability, accelerate development cycles, and enhance predictive decision-making.
Key Responsibilities:
Process Optimization
- Develop, qualify, and optimize ECP/PVD processes for research, prototyping, and early technology enablement.
- Design and execute structured experiments (DOE) to investigate process variability, identify key parameters, and enhance repeatability and throughput.
- Apply AI/ML models (e.g., predictive modeling, anomaly detection) to accelerate process optimization and enhance yield.
Data Analytics & Process Control
- Monitor, analyze, and control ECP/PVD performance using SPC, statistical analysis, and advanced data analytics tools.
- Build and maintain dashboards for realtime process monitoring, trend analysis, and predictive maintenance.
- Utilize machine learning or automation scripts to detect deviations, predict failures, and support rootcause analysis.
Materials & Chemistry Management
- Manage plating bath chemistry (Cu, Ni, Au, SnAg, TSV, RDL, etc.), ensuring stability, replenishment accuracy, and bath lifetime control.
- Characterize thin films and deposition quality using metrology and analytical tools (SEM, XRR, XRD, AFM, profilometry, etc.).
Troubleshooting & Operations Support
- Diagnose and resolve process and equipment issues related to ECP/PVD tools.
- Collaborate with equipment engineers, material scientists, and R&D researchers to address crossfunctional challenges.
- Maintain cleanroom compliance and ensure adherence to safety, quality, and operational protocols.
Documentation & Reporting
- Maintain thorough process documentation, including SOPs, experiment logs, failure analysis reports, and improvement proposals.
- Present technical findings, insights from data analytics, and recommendations to engineering and leadership teams.
Job Requirements:
- Bachelor's or Master's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related fields.
- Handson experience in thinfilm deposition, surface finishing, semiconductor or advanced packaging processes preferred.
- Strong proficiency in data analytics using tools such as Python, MATLAB, JMP, or statistical software.
- Familiarity with AI/ML applications in manufacturing or process engineering (e.g., regression models, clustering, anomaly detection).
- Knowledge of SPC methodology and structured problem-solving techniques (8D, FMEA, DOE, etc.).
- Experience with cleanroom practices and semiconductor equipment operation is a plus.
- Strong analytical mindset, ability to handle complex datasets, and passion for process innovation.
