Bonding Process Control Engineer Role Summary
We are seeking a Bonding Process Control Engineer responsible for owning, optimizing, and sustaining waferlevel bonding processesincluding hybrid wafertowafer bonding, chiptowafer bonding, and Temporary Bonding & Debonding (TBDB) across multiple wafer sizes and thicknesses.
This role focuses on process stability, SPC governance, yield improvement, defect reduction, and robust process-control strategies for both development and smallvolume prototying. The engineer will play a critical role in enabling nextgeneration heterogeneous integration and advanced packaging technologies.
Key Responsibilities:
Process Control & SPC Ownership
- Own and maintain SPC control strategies for bonding processes across multiple toolsets.
- Define Critical Process Parameters (CPPs) and Critical Quality Attributes (CQAs) such as alignment accuracy, bond strength, defectivity, warpage, and thickness.
- Establish and optimize control limits, reaction plans, and process windows to ensure process robustness and manufacturability.
Yield Improvement & Defect Reduction
- Drive yield enhancement through structured data analytics, statistical modeling, DOE, and correlation studies.
- Lead rootcause investigations for issues such as voids, delamination, alignment offsets, particleinduced defects, and bonding nonuniformity.
- Implement systematic defectreduction strategies and corrective actions.
Tool & Recipe Ownership
- Serve as the process owner for bonding toolsets, including recipe setup, qualification, matching, and continuous improvement.
- Execute tool health monitoring, runtorun control, and equipment baseline management.
- Collaborate with equipment engineering to enable uptime, stability, and PM efficiency.
CrossFunctional Collaboration
- Work closely with process integration, R&D, equipment engineering, manufacturing, and quality teams to achieve product ramps, technology transfers, and new capability development.
- Support development builds, engineering lots, and technology bringup activities.
Troubleshooting & Advanced Analytics
- Diagnose complex process failures involving void formation, debonding, overlay/registration errors, thermal mismatch, and stressrelated defects.
- Apply AIassisted analytics (where available) and multivariate methods to accelerate fault isolation and process optimization.
Documentation & Governance
- Develop and maintain comprehensive documentation:
SOPs
Control Plans
OCAPs (OutofControl Action Plans)
Process Qualification Packages
- Ensure compliance with internal quality systems and customer requirements.
Job Requirements:
- Bachelor's degree in Materials Science, Chemical, Mechanical, Electrical Engineering, or related fields.
- 3+ years of handson experience in wafer bonding, advanced packaging, 3D integration, or related semiconductor process engineering.
Process & Tool Expertise
- Practical experience with hybrid wafer bonding, direct bonding, and/or Temporary Bonding & Debonding (TBDB) equipment.
- Familiarity with bondingrelated metrology such as IR inspection, SAM, profilometry, bondstrength measurement, overlay/alignment metrology, and thickness mapping.
Data & Statistical Skills
- Strong command of SPC, process control methodology, statistical data analysis, DOE, and problemsolving frameworks (e.g., 8D, FMEA).
- Experience in highvolume manufacturing or advanced packaging R&D environments is a strong plus.
Industry Knowledge
- Understanding of 3DIC, chiplets, hybrid bonding, and advanced packaging process flows.
- Experience with HVM tools, bonding chemistry, plasma activation, surface conditioning, and thermal/mechanical behavior of bonded wafer stacks is advantageous.
