RESPONSIBILITIES :
- Understand customer's problems (needs and wants), design and recommends solutions to meet their needs and ensures customer satisfaction.
- Lead the design/delivery of TCI (Test Cell Integration) or multiple technologies solutions.
- Prepare training documents to both in-house engineers and customer training needs.
- Conduct relevant application support service trainings and co-trainer in customer training.
- Able to lead a project team to accomplish projects in a timely manner.
- Holding key customer account and manages projects together with factory engineering to meet customer's needs in both technical requirements and time schedule.
- Understands and applies Solution Planning & Implementation standards.
- Build and establish strong relationships with factory to co-develop solutions to IPG related problems.
- To be effectively identifying design related problems and suggest necessary changes to the factory through an orderly reporting manner.
- Take initiative to own and solve specific customer issues.
REQUIREMENTS AND QUALIFICATIONS :
- At least 4 years relevant experience.
- Good knowledge of semiconductor assembly and test industry. Preferably have experiences developing test programs or have supported test applications on at least one of the following product or technologies Advantest, Verigy, LTX-Credence, Teradyne, MEMs testing, load board design and sockets.
- Good knowledge of test sockets (Contactors) design concept.
- Loadboard/Probecard design requirements and debugging.
- Flexibility and willingness to travel and support customers globally.
- Minimum Bachelor Degree or equivalent in electronics and electrical engineering from a recognized university.
- Good command of written and spoken English with strong interpersonal skills.
- Knowledge of using MS Office (Words, Excel & PowerPoint) is mandatory.
- Added advantage with knowledge of CAD software (AutoCAD, SolidWorks).
- Able to start work at short notice.
