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Micron's Singapore Technology Development (TD) team is seeking a passionate and driven Process Development Engineer to support the rapid deployment of advanced NAND technology nodes. This role is critical in enhancing process margins, integrating new technologies into manufacturing, and collaborating globally to shape the future of memory technology.
Key Responsibilities
- Develop and optimize unit processes to meet yield and quality targets for advanced NAND devices
- Evaluate innovative process and equipment solutions for early experimentation and process margin improvement
- Collaborate with Singapore-based Diffusion manufacturing teams to identify and prioritize key technology challenges
- Integrate and troubleshoot processes within cross-functional teams focused on yield and quality enhancement
- Partner with Boise TD Films teams to align future device requirements with process capabilities
- Identify disruptive process technologies early and define viable implementation paths with global TD and manufacturing teams
- Conduct fundamental research, hardware evaluations, and novel process testing to support intellectual property generation
- Design and execute experiments to expand process margins and validate manufacturability of next-node solutions
- Lead cross-functional initiatives to simplify processes and implement improvements
- Embed best-known manufacturing practices into early-stage development of new nodes
- Develop and apply advanced process monitoring and control methodologies.
- Serve as a technical expert, contributing to process, equipment, and procedural improvements
- Lead multidisciplinary projects across teams, sites, and suppliers focused on quality, yield, cost, and productivity
- Advise management on significant technical issues and drive innovation through patents and technical publications
- Maintain strict adherence to Micron's Intellectual Property protection policies
- Engage continuously with global TD partners and suppliers to push for breakthrough solutions
- Own and manage module-level business processes
Requirements
- Bachelor's in Materials Science, Chemical/Microelectronic Engineering, or Physics with minimum 5 years of relevant experience
- Master's, or PhD in Materials Science, Chemical/Microelectronic Engineering, or Physics with minimum 2 years of relevant experience
- Strong understanding of:
- - Flow dynamics, thermodynamics, and physical phenomena in deposition
- - Precursor depletion effects in 3D structures and mitigation strategies
- - Interface characterization techniques (e.g., SIMS, XPS, EDX, SEM/TEM)
- - Integration and structural constraints in film deposition processes
- - Memory process flows, especially for planar and vertical NAND
- Proficiency in data analysis tools (e.g., Y3) and Design of Experiments (DoE)
- Proven collaboration skills with local and global teams
- Excellent communication skills for both in-person and remote interactions
- Self-motivated, adaptable, and capable of managing multiple projects in a dynamic environment
- Willingness to travel and stay at Boise TD for extended periods (2-4 months) to support technology development
