Senior Engineer, NTI Metrology

As Senior Metrology Development Engineer in the Singapore TD department at Micron Technology Inc., you will be responsible for rapid deployment of innovative 3D NAND process technologies, drive development efforts prior to device ramp, define & execute effective actions to enable solutions required to hit key breakthroughs & achieve the required performance within timelines. This role requires hands-on experience with X ray-based metrology techniques within the semiconductor industry, particularly for advanced 3D NAND applications.

Job Responsibilities

• Process development tasks such as developing Scattered-Electron-Microscope (SEM) metrology models, driving the understanding of new metrology technology and measurement techniques in 3D NAND technology, including X‑ray-based metrology (e.g., XRF, XRR, XRD, SAXS, X‑ray CD, or X‑ray tomography).

• Own applications and develop processes of new nodes, demonstrating X‑ray metrology techniques to enable robust process control.

• Identify and provide solutions for inline detection in collaboration with process engineer and process integration, with emphasis on non‑destructive X‑ray methods for buried or high‑aspect‑ratio structures.

• Identify modeling opportunities using metrology and detection data to explain electrical failed signature at probe, integrating X‑ray and SEM data where applicable.

• Collaborate with HVM Metro team on technology choices for the upcoming nodes and able to translate future technology device needs into clear equipment roadmap requirements, including X‑ray metrology capability gaps and scaling requirements.

• Work closely with the planning team to understand Model-on-record (MOR) impact of new technology. Maintain MOR accuracy to enable successful technology ramp.

• Influence supplier equipment roadmap to enable new technology development in Micron, specifically driving next‑generation X‑ray metrology solutions for advanced 3D NAND structures.

Requirements:

• Bachelor's or Master's degree in Material Science, Physics, or a related field.

• Familiarity with X-ray based metrology techniques, materials characterization, and data analysis, with demonstrated experience in metrology within a semiconductor manufacturing or development environment.

• Basic knowledge of operating, troubleshooting and hands‑on experience with X‑ray metrology tools (e.g., XRF, XRR, XRD, SAXS, X‑ray CD, or X‑ray imaging systems).

• Strong collaboration and communication skills, with the ability to work in multidisciplinary teams.

• Analytical and problem-solving skills, with a focus on continuous improvement.

• Display Micron Value of People. Innovation, Tenacity, Collaboration and Customer Focus

Preferred Skills:

• Experience with semiconductor device fabrication and characterization.

• Direct experience applying X‑ray metrology to advanced nodes (e.g., high‑aspect‑ratio features, buried layers, or complex 3D NAND stacks)

• Knowledge of statistical analysis and data interpretation.

• Familiarity with data science and machine learning is a plus.