Senior/ Engineer, Advanced Packaging Equipment - Post Wafer Fabrication (PWF)/ Assembly

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Micron's vision is to transform how the world uses information to enrich life . Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.

We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron's Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing.

We are looking for an Advanced Packaging Equipment Engineer to join our Advanced Packaging Technology Development (APTD) team!

Your responsibilities include but are not limited to developing and optimizing next generation, first of a kind (FOAK) wafer and die Equipment for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will also be required to identify, diagnose, and resolve equipment related problems. Additional responsibilities include coordinating and carrying out equipment evaluation to implement changes, leading and participating in equipment maturity and cost reduction activities.

Key responsibilities and duties include:

Equipment Development:

• Develop and optimize advanced packaging equipment for technology enablement, including wafer-level packaging and stacking

• Focus on improving equipment capability, enabling process improvements, reducing costs, and enhancing productivity

• Establish and improve equipment management projects to deliver technode requirements

Equipment Strategy:

• Evaluate and promote new equipment and materials to enhance process capabilities

• Establish hardware strategic roadmaps for 5+ years in post probe wafer and die processing

• Developing wafer and assembly equipment to meet the physical and electrical requirements of Micron's products. cost, availability, and improve hardware and process capability

Quality Improvement:

• Ensure defense coverage through process, measurement, inspection, and testing

• Establish correlations between defense mechanisms to identify improvement opportunities

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities

Collaboration and Coordination:

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives

• Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control

• Ensure smooth transition from new product development, qualification, small volume production to high volume production

Requirements

• B.S/M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or other related technical fields

• 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field

• Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware

• Tenacity to work effectively under timelines and limited resources

• Consistent track record to solve problems and address root causes